Short Courses

Registration for short courses is now closed. No further registrations can be accepted.

The 13th International Seminar on Paste & Thickened Tailings is proud to present a series of short courses to be conducted during the 2010 seminar in Toronto, Canada.

These courses are designed and presented by individuals from academia who are leaders in the continuing development of paste technology and its application.

The three short courses will be conducted concurrently on Monday, May 3, 2010 from 8:30 am until 5:00 pm (EST).

The cost to attend each short course is $350.00 per person plus tax. A reduced rate of $175.00 per person plus taxes is available for post-secondary students. This price includes all course materials and lunch.


(SOLD OUT)SHORT COURSE #1: Post-deposition Behaviour of Surface Deposited Thickened Tailings

This short course will provide course participants with a summary of experience and research regarding the behaviour of thickened tailings following their deposition from the pipeline.

The topics of discussion will include:

Presenters Include:



(SOLD OUT) SHORT COURSE #2: Design of Paste Backfill Systems

This short course will address many of the emerging design tools, guidelines, and models that can be used for practical engineering of paste backfill systems.

The topics of discussion will include:

Presenters Include:



(SOLD OUT)SHORT COURSE #3: Rheology of Paste and Thickened Tailings

This short course will introduce the fundamentals of rheology with an emphasis on high concentration mineral slurries. It will also demonstrate how the information can be applied to the design and operation of paste or thickened slurry systems (i.e., slurry preparation, transportation, and distribution).

The topics of discussion will include:

The materials will be divided into four main sections: theory, testing, causality and application. A primer will be distributed to all of those planning to attend the course to provide basic background information (e.g., Newtonian fluid mechanics, mechanics of materials, etc).

Presenters Include:



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